MCZ33903DS5EK/R2 NXP

Description

MCZ33903DS5EK/R2

Overview

The MCZ33903DS5EK/R2 is a highly integrated, flexible, and scalable power management solution for automotive and industrial applications. This System-in-Package (SiP) device provides advanced features and control functions, making it an ideal choice for complex system designs.

Features

  • High-performance, 32-bit MCU with DSP capabilities
  • Dual-core architecture with 128 KB of on-chip flash memory and 32 KB of RAM
  • Multiple communication interfaces, including:
    • LIN 2.2
    • CAN with partial networking
    • SPI with data rates up to 10 Mbps
    • SCI (Serial Communication Interface) with data rates up to 4 Mbps
  • Advanced timer modules with:
    • Up to 16-bit resolution
    • Support for multiple timer modes, including PWM and capture
  • Power management features, including:
    • 5V and 3.3V voltage regulators
    • Low-power and sleep modes for reduced power consumption
  • High-temperature range operation: -40°C to 125°C

Technical Specifications

  • Device Type: 32-bit MCU with DSP
  • Mid Temperature Range: -40°C to 125°C
  • Remarks: AEC-Q100 qualified

Package Information

  • Package Type: SSOP-36
  • Package Width: 10.2 mm
  • Package Length: 7.7 mm

Applications

  • Automotive control systems
  • Industrial control systems
  • Power management systems
  • Communication systems

Documentation

For more detailed information, please refer to the device datasheet and other relevant documentation.