Description

MC33174VDR2G ON Semiconductor, Dual High-Speed, Low-Power, ECL-to-TTL/TTL-to-ECL Translator

Overview

The MC۳۳۱۷۴ is a dual high-speed, low-power ECL-to-TTL/TTL-to-ECL translator, designed for converting ECL logic levels to TTL logic levels and vice versa. This device is particularly useful in applications where data needs to be transferred between systems or components operating at different logic levels.

Features

• High Speed: The MC33174 supports high-speed data translation, making it suitable for applications requiring fast data transfer.
• Low Power Consumption: Designed to operate at low power, reducing heat generation and extending component lifespan.
• Dual Conversion: Offers both ECL-to-TTL and TTL-to-ECL translation in a single package, enhancing flexibility in system design.
• Small Package: The DNF package is compact, which is ideal for applications where space is limited.

Parameters

• Package Type: DNF (8-Pin SOIC Narrow Body)
• Package Code: VDR2G
• Operating Temperature Range: -40°C to +85°C
• Supply Voltage: VCC = 5V ±5%, VE = -5.2V
• Propagation Delay:
  • ECL to TTL: 2.5 ns typical
  • TTL to ECL: 3.5 ns typical
• Power Consumption:
  • ICC (TTL Output): 24 mA typical
  • IE (ECL Output): 40 mA typical
• Logic Levels:
  • ECL Input: Compatible with MECL 10,000 logic levels
  • TTL Input: Compatible with TTL logic levels
  • ECL Output: MECL 10,000 logic levels
  • TTL Output: Standard TTL logic levels
• Frequency: Up to 200 MHz

Applications

• Data Communication Systems: Useful in applications where high-speed data transfer is required between different logic level systems.
• Test Equipment: Can be used in test and measurement equipment for logic level conversion.
• Computer Systems: Ideal for integration into computer systems that require communication between ECL and TTL-based peripherals.
• Networking Equipment: Suitable for use in networking devices to facilitate communication between components operating at different logic levels.

Ordering Information

• MC33174VDR2G: This part number specifies the device in a DNF package.
• Packing Type: Available in reels for automated assembly or in tubes for manual assembly.

Documentation and Support

For detailed specifications, application notes, or to download datasheets, please visit the manufacturer’s website or contact their support team. Always ensure to handle the components with appropriate ESD protection to prevent damage.